Company Filing History:
Years Active: 2020-2022
Title: Bo-Hao Chang: Innovator in Electronic Packaging
Introduction
Bo-Hao Chang is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 2 patents. His innovative work focuses on improving substrate structures to enhance the reliability and performance of electronic devices.
Latest Patents
Chang's latest patents include advancements in electronic package and substrate structures. One of his notable inventions is a substrate structure that features chamfers. This design alleviates stress generated during the packaging process, thereby preventing cracks in the substrate. Additionally, he has developed an electronic package that employs this innovative substrate structure, further enhancing its durability and functionality.
Career Highlights
Bo-Hao Chang is currently associated with Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor packaging industry. His work at this organization has allowed him to push the boundaries of electronic packaging technology, contributing to the development of more reliable electronic components.
Collaborations
Throughout his career, Chang has collaborated with talented individuals such as Po-Hao Wang and Chang-Fu Lin. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Bo-Hao Chang's contributions to electronic packaging through his patented inventions demonstrate his commitment to advancing technology in this field. His work not only enhances the performance of electronic devices but also sets a standard for future innovations.