Bisweswar Patnaik

Title: The Innovations of Bisweswar Patnaik: Pioneering Multilevel Interconnections

Introduction

Bisweswar Patnaik, an accomplished inventor based in Wappingers Falls, NY, has made significant contributions to the field of semiconductor technology. He holds two patents that showcase his innovative methodologies for interconnection metallurgy, particularly in the efficient construction of conductive pathways within semiconductor substrates.

Latest Patents

Patnaik's latest patents highlight his expertise in forming interconnections for multilevel interconnection metallurgy. One of his notable inventions is a method for forming feedthrough connections, or via studs, between metallization levels. This patent outlines a process where an etch barrier is utilized to prevent the etching of the first level metallurgy while a conductive pattern is established. This method enhances the reliability and precision of multilayer semiconductor designs.

Another significant invention by Patnaik involves forming self-aligned via holes in thin film interconnection systems. This technique ensures that accurately located via holes are created even with potential misalignment of the masks. By utilizing a layered approach of dielectric materials and a polymeric substance, Patnaik effectively addresses challenges in achieving seamless interconnections atop substrates.

Career Highlights

Bisweswar Patnaik is affiliated with the International Business Machines Corporation (IBM), a leading technology and consulting company. His role within IBM allows him to collaborate on cutting-edge research and development in semiconductor technologies. With his innovative work, Patnaik contributes to advancing the field and enhancing the performance of electronic devices.

Collaborations

Throughout his career, Patnaik has worked alongside notable colleagues, including Hormazdyzr D. Dalal and Homi G. Sarkary. These collaborations have fostered a rich environment of innovation and ingenuity, allowing for the development of groundbreaking technologies that push the boundaries of semiconductor manufacturing.

Conclusion

In summary, Bisweswar Patnaik stands out as a prominent inventor whose work has reshaped the landscape of semiconductor interconnections. His patents reflect a deep understanding of metallization techniques, paving the way for future advancements in technology. As he continues to innovate within his role at IBM, his contributions will undoubtedly influence the evolution of electronic systems for years to come.