Binwei Wang

Title: The Innovative Contributions of Binwei Wang

Introduction

Binwei Wang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of printed circuit board manufacturing. His innovative approach has led to the development of a unique method that enhances the efficiency and quality of double-sided printed circuit boards.

Latest Patents

Binwei Wang holds a patent for a "Method of manufacturing double-sided printed circuit board." This invention provides a comprehensive process for creating a double-sided printed circuit board. The method begins with the formation of an insulation substrate by creating multiple through holes on a Copper Clad Laminate (CCL) with the copper foil surface removed. An electro-less copper layer is then plated on the substrate to form a plurality of plated through holes. Following this, a wire pattern is established on the substrate, and a solder preventive layer is applied on top of the wire pattern. Openings are created in the solder preventive layer to expose the contact pads, and finally, a protective layer is plated on top of the contact pads.

Career Highlights

Binwei Wang is currently associated with Nan Ya Printed Circuit Board Corporation, where he continues to innovate in the field of electronics. His work has been instrumental in advancing the technology behind printed circuit boards, making them more reliable and efficient for various applications.

Collaborations

Throughout his career, Binwei Wang has collaborated with talented individuals such as Hung-En Hsu and Shing-Fun Ho. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Binwei Wang's contributions to the field of printed circuit board manufacturing are noteworthy. His patented method showcases his commitment to innovation and excellence in technology. His work continues to influence the industry and inspire future advancements.