Vienna, VA, United States of America

Binh Q Le


Average Co-Inventor Count = 4.6

ph-index = 6

Forward Citations = 307(Granted Patents)


Company Filing History:


Years Active: 1997-2005

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7 patents (USPTO):Explore Patents

Title: Innovations of Binh Q Le

Introduction

Binh Q Le is a notable inventor based in Vienna, VA, who has made significant contributions to the field of technology and engineering. With a total of seven patents to his name, he has developed innovative solutions that address critical challenges in detection and semiconductor technology.

Latest Patents

One of his latest patents is an apparatus and methods for detecting explosives and other substances. This explosive detector utilizes an array of molecularly imprinted polymer (MIP) coated, bifurcated fiber optic cables to form an image of a target molecule source. Individual sensor fiber assemblies, each with a calibrated airflow, are used to expose the fibers to the target molecule. The detector energizes a dedicated excitation light source for each fiber while simultaneously reading and processing the intensity of the resulting fluorescence that indicates the concentration of the target molecule. Processing electronics precisely control the excitation current and measure the detected signal from each narrow band pass filter and photodiode. A computer with a display processes the data to form an image of the target molecule source that can be used to identify the source even when low-level contamination of the same molecule is present. This detector can also be used to detect multiple and/or non-explosive targets by varying the MIP coating.

Another significant patent is the semiconductor die adapter and method of using it. This assembly includes a semiconductor die cut from a wafer, with the die having an active surface that includes bond pads. A die adapter, also having bond pads, is bonded to the semiconductor die. Die-to-adapter connectors electrically connect the die bond pads to the adapter bond pads. Finally, adapter-to-substrate connectors electrically connect the adapter bond pads to a device substrate. Having bond pads on the die adapter eliminates the need to break and remake the electrical connections to the original bond pads on the die during burn-in testing of the die.

Career Highlights

Binh Q Le is affiliated with The Johns Hopkins University, where he continues to contribute to research and development in his field. His work has garnered attention for its innovative approach and practical applications.

Collaborations

He has collaborated with notable colleagues, including Ark L Lew and Joseph J Suter, who share his commitment to advancing technology and innovation.

Conclusion

Binh Q Le's contributions to the fields of detection technology and semiconductor engineering highlight his role as a leading inventor. His innovative

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