The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2005
Filed:
May. 31, 2002
Binh Q. Le, Vienna, VA (US);
Ark L. Lew, Ellicott City, MD (US);
Harry K. Charles, Jr., Laurel, MD (US);
Paul D. Schwartz, Arnold, MD (US);
Seppo J. Lehtonen, Columbia, MD (US);
Sharon X. Ling, Clarksville, MD (US);
Binh Q. Le, Vienna, VA (US);
Ark L. Lew, Ellicott City, MD (US);
Harry K. Charles, Jr., Laurel, MD (US);
Paul D. Schwartz, Arnold, MD (US);
Seppo J. Lehtonen, Columbia, MD (US);
Sharon X. Ling, Clarksville, MD (US);
The Johns Hopkins University, Baltimore, MD (US);
Abstract
A semiconductor die adapter assembly includes a semiconductor die cut from a wafer, the die having an active surface including bond pads. A die adapter, also having bond pads, is bonded to the semiconductor die. Die-to-adapter connectors electrically connect the die bond pads to the adapter bond pads. Finally, adapter-to-substrate connectors electrically connect the adapter bond pads to a device substrate. Having bond pads on the die adapter eliminates the need to break and remake the electrical connections to the original bond pads on the die during burn-in testing of the die.