Bingchien Wu

Title: The Innovations of Bingchien Wu

Introduction

Bingchien Wu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of three patents. His work focuses on innovative methods for semiconductor packaging and bonding techniques.

Latest Patents

Bingchien Wu's latest patents include a semiconductor package and method of bonding workpieces. This semiconductor package features a first semiconductor device and a second semiconductor device. The first semiconductor device is equipped with a first alignment pattern that contains a plurality of first scale patterns arranged in a first direction. The second semiconductor device is mounted over the first semiconductor device and includes a second alignment pattern with a plurality of second scale patterns arranged in a second direction parallel to the first direction. Notably, the scale pitch of the first scale patterns differs from that of the second scale patterns. Another patent involves a similar semiconductor package, method of bonding workpieces, and method of manufacturing a semiconductor package, emphasizing the innovative alignment and bonding techniques.

Career Highlights

Bingchien Wu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role involves developing advanced semiconductor packaging solutions that enhance device performance and reliability.

Collaborations

Bingchien Wu has collaborated with esteemed colleagues such as Wei-Jen Wu and Chun-Yen Lo. Their combined expertise contributes to the advancement of semiconductor technologies and innovations.

Conclusion

Bingchien Wu's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the development of advanced semiconductor packaging solutions.