Bing-Yun Cheng

Title: Innovations by Bing-Yun Cheng in Semiconductor Technology

Introduction

Bing-Yun Cheng is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of heat dissipating semiconductor device packages. With a total of 2 patents, Cheng's work has advanced the efficiency and effectiveness of semiconductor devices.

Latest Patents

Cheng's latest patents focus on innovative methods for creating semiconductor device packages. One of his key inventions involves a heat sink matrix and a substrate, where multiple semiconductor devices are attached to the substrate. A package body is formed between the heat sink matrix and the substrate, encapsulating the semiconductor devices. The process includes forming a series of cutting slots that allow for the singulation of the heat sink matrix and substrate into individual semiconductor device packages. This method enhances the thermal management of semiconductor devices, which is crucial for their performance.

Career Highlights

Bing-Yun Cheng is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to push the boundaries of semiconductor technology. His work has not only contributed to the company's success but has also positioned him as a key figure in the industry.

Collaborations

Cheng has collaborated with several talented individuals in his field, including Kuang-Hsiung Chen and Sheng-Ming Wang. These collaborations have fostered innovation and have led to the successful development of advanced semiconductor solutions.

Conclusion

Bing-Yun Cheng's contributions to semiconductor technology through his innovative patents and collaborations highlight his importance in the field. His work continues to influence the development of efficient semiconductor devices, making a lasting impact on the industry.