Hsinchu, Taiwan

Bing-Shun Yu


Average Co-Inventor Count = 3.6

ph-index = 2

Forward Citations = 15(Granted Patents)


Company Filing History:


Years Active: 2009-2011

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3 patents (USPTO):Explore Patents

Title: Innovations of Bing-Shun Yu in Semiconductor Packaging

Introduction

Bing-Shun Yu is a notable inventor based in Hsinchu, Taiwan, recognized for his contributions to semiconductor packaging technology. With a total of three patents to his name, Yu has made significant advancements in the field, particularly in enhancing the efficiency and reliability of semiconductor packages.

Latest Patents

One of Yu's latest patents is titled "Semiconductor package having substrate ID code and its fabricating method." This invention reveals a semiconductor package that incorporates a substrate ID code, which is inscribed in the solder mask or encapsulant. This innovation allows for effective quality control and failure tracking without altering the package's appearance. The substrate ID code can be implemented using existing laser imprinting machines, ensuring that the complexity of the packaging process remains manageable while protecting the circuits from damage.

Another significant patent by Yu is the "Semiconductor package with fastened leads." This design features a leadframe with leads, a chip, a paddle, an adhesive, and an encapsulant. The paddle is securely attached to the leads, enhancing support and preventing any shifting during molding processes. This design also improves heat dissipation, making it a valuable advancement in semiconductor packaging.

Career Highlights

Bing-Shun Yu is currently employed at Powertech Technology Inc., a leading company in semiconductor packaging solutions. His work has contributed to the company's reputation for innovation and quality in the industry.

Collaborations

Yu has collaborated with notable coworkers, including Chin-Ti Chen and Chin-Fa Wang, who have also made significant contributions to the field of semiconductor technology.

Conclusion

Bing-Shun Yu's innovative patents and contributions to semiconductor packaging demonstrate his expertise and commitment to advancing technology in this critical field. His work continues to influence the industry positively, ensuring better quality and efficiency in semiconductor products.

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