Jiangsu, China

Bin Tian

This inventor holds 1 USPTO granted patent. Top assignee: E Surfing Iot Co., Ltd. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bin Tian. Retrieved from https://idiyas.com/inventor/bin-tian-duboyrw7

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Bin Tian

Introduction

Bin Tian is a notable inventor based in Jiangsu, China. He has made significant contributions to the field of Internet of Things (IoT) technology. His work focuses on enhancing cloud platform functionalities, particularly in relation to IoT cards.

Latest Patents

Bin Tian holds a patent for a "Cloud platform binding method and system for Internet of Things card, and device and medium." This innovative method involves a series of steps that ensure secure and efficient binding of IoT cards to cloud platforms. The process includes acquiring login messages and device identification information, verifying them with an IoT server, and facilitating data uploads while ensuring legitimacy. This patent represents a significant advancement in automating cloud-card binding functions.

Career Highlights

Bin Tian is currently employed at E Surfing IoT Co., Ltd. His role involves developing cutting-edge solutions that integrate cloud technology with IoT applications. His expertise in this area has positioned him as a key player in the advancement of IoT systems.

Collaborations

Bin Tian collaborates with talented individuals such as Ming Zhu and Xia Ding. Together, they work on innovative projects that push the boundaries of IoT technology.

Conclusion

Bin Tian's contributions to the field of IoT through his patent and collaborative efforts highlight his role as an influential inventor. His work continues to shape the future of cloud technology in the IoT landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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