Savoy, IL, United States of America

Bin Peng

This inventor holds 1 USPTO granted patent. Top assignee: University of Illinois. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bin Peng. Retrieved from https://idiyas.com/inventor/bin-peng-1l1vfr0l

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Bin Peng and Crop Yield Prediction

Introduction

Bin Peng is an inventor associated with the University of Illinois in Savoy, Illinois. His patent work addresses crop yield prediction, combining crop development information with modeling to estimate yields at different geographic scales.

Latest Patents

Peng is credited with 1 patent: “Apparatus and Method for Crop Yield Prediction.” The invention describes a processing system that identifies occurrences of one or more crop phenology stages and uses those observations to optimize a yield model. The optimized model produces a predicted yield for a first region, which is then used to generate a prediction for a smaller second region. The disclosure also notes that additional embodiments are possible.

Career Highlights

The available information connects Peng’s inventive work with the University of Illinois. His patent focuses on using crop growth stages to refine yield estimates across regions of different sizes.

Collaborations

Jian Peng is identified as a coworker. The provided information does not specify further details about their collaboration.

Conclusion

Bin Peng’s patent presents a method for refining crop yield predictions by linking observed phenology stages to regional yield models, with the aim of producing estimates for both broader and smaller areas.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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