Saratoga, CA, United States of America

Bin-Ming Benjanim Tsai


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: The Innovations of Bin-Ming Benjanim Tsai

Introduction

Bin-Ming Benjanim Tsai is a notable inventor based in Saratoga, CA (US). He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique inspection system that enhances the efficiency of wafer inspections.

Latest Patents

Tsai holds a patent for a "Confocal wafer inspection system and method." This invention provides a semiconductor wafer inspection system that utilizes a multiple element arrangement, such as an offset fly lens array. The system employs a laser to transmit light energy toward a beam expander, which creates an illumination field. The offset fly lens array converts this light energy into an offset pattern of illumination spots. The design includes a lensing arrangement that imparts light energy onto the specimen and passes it toward a pinhole mask, which is mechanically aligned with the offset fly lens array. This innovative approach allows for rapid sensing and includes an autofocus system that measures and cancels topological features of the specimen.

Career Highlights

Tsai is currently associated with Kla Tencor Corporation, where he continues to advance semiconductor inspection technologies. His work has been instrumental in improving the accuracy and speed of wafer inspections, which are critical in semiconductor manufacturing.

Collaborations

Throughout his career, Tsai has collaborated with notable colleagues, including Christopher R Fairley and Tao-Yi Fu. These collaborations have contributed to the development of advanced technologies in the semiconductor industry.

Conclusion

Bin-Ming Benjamin Tsai's contributions to semiconductor technology through his innovative patent demonstrate his expertise and commitment to advancing the field. His work continues to influence the efficiency of wafer inspections in the industry.

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