Company Filing History:
Years Active: 2014
Title: The Innovations of Bin-Ming (Benjamin) Tsai
Introduction
Bin-Ming (Benjamin) Tsai is an accomplished inventor based in Saratoga, CA (US). He has made significant contributions to the field of optical metrology, particularly through his innovative patent that enhances measurement sensitivity. His work is vital for advancing technologies that require precise measurements in various applications.
Latest Patents
Tsai holds a patent titled "Optical metrology using targets with field enhancement elements." This patent presents methods and systems designed to enhance metrology sensitivity to specific parameters of interest. The field enhancement elements (FEEs) are constructed as part of a specimen to improve the measurement sensitivity of structures present on the specimen. The design of these FEEs considers measurement goals and manufacturing design rules, ensuring compatibility with the overall device fabrication process. The addition of FEEs enhances the measurement of opaque materials, high-aspect ratio structures, and low-sensitivity parameters. Notable measurements facilitated by this innovation include critical dimension, film thickness, film composition, and optical scatterometry overlay.
Career Highlights
Tsai is currently employed at Kla Tencor Corporation, where he continues to push the boundaries of optical metrology. His expertise and innovative approach have positioned him as a key figure in his field. With a patent count of 1 patent, Tsai's contributions are recognized and valued within the industry.
Collaborations
Throughout his career, Tsai has collaborated with notable colleagues, including Jonathan M Madsen and Andrei V Shchegrov. These collaborations have further enriched his work and contributed to advancements in optical metrology.
Conclusion
Bin-Ming (Benjamin) Tsai's innovative work in optical metrology exemplifies the importance of enhancing measurement sensitivity in various applications. His contributions continue to influence the field and pave the way for future advancements.