Xi'an, China

Bin Jia

This inventor holds 1 USPTO granted patent. Top assignee: Rf Micro Devices, Inc.. Active years: 2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bin Jia. Retrieved from https://idiyas.com/inventor/bin-jia-omq641ah

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: The Innovations of Bin Jia

Introduction

Bin Jia is a notable inventor based in Xi'an, China. He has made significant contributions to the field of radio frequency (RF) technology. His work focuses on improving the performance of multi-stage RF power amplifiers, which are essential in various communication systems.

Latest Patents

Bin Jia holds a patent for "Gain synchronization circuitry for synchronizing a gain response between output stages in a multi-stage RF power amplifier." This innovative circuitry synchronizes the gain response of both high-power and low-power amplifier paths. By achieving this synchronization, the gain linearity of the multi-stage RF amplifier is enhanced, leading to improved performance in RF applications. He has 1 patent to his name.

Career Highlights

Bin Jia is currently employed at RF Micro Devices, Inc., where he continues to develop cutting-edge technologies in the RF domain. His expertise in gain synchronization circuitry has positioned him as a valuable asset in the industry.

Collaborations

Throughout his career, Bin Jia has collaborated with talented individuals such as William Lam and Yuan Wei. These partnerships have fostered innovation and contributed to the advancement of RF technology.

Conclusion

Bin Jia's contributions to the field of RF power amplifiers demonstrate his commitment to innovation and excellence. His work not only enhances the performance of communication systems but also showcases the importance of collaboration in technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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