Chengdu, China

Bin Huang

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Huawei Cloud Computing Technologies. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bin Huang. Retrieved from https://idiyas.com/inventor/bin-huang-xt9hz2cr

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Bin Huang: Data Access and Storage Innovation.

Introduction

Bin Huang is an inventor based in Chengdu, China, associated with Huawei Cloud Computing Technologies. His patent work concerns data access and tape-storage management.

Latest Patents

Huang is credited with 1 patent: “Data Access Method and System.” The invention describes a target storage node that applies data access policies selected or entered by a user through a management platform. The node receives a write-data stream identifying a tape, the data to be written, and the required tape space within a data partition. It then writes the data to the tape using an available tape drive in accordance with the applicable policy.

Career Highlights

Huang’s listed patent reflects work on managing data writes across tape storage, with an emphasis on applying user-defined access policies at the storage-node level. He is associated with Huawei Cloud Computing Technologies.

Collaborations

The provided information lists Lin Wu and Shining Wan as Huang’s coworkers.

Conclusion

Bin Huang’s patent focuses on policy-guided data access and tape writing, contributing to storage-management innovation associated with Huawei Cloud Computing Technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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