Shantou, China

Bin Huang

This inventor holds 1 USPTO granted patent. Top assignee: Shantou Institute of Ultrasonic Instruments Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bin Huang. Retrieved from https://idiyas.com/inventor/bin-huang-1mjwirqz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Bin Huang and Ultrasound Attenuation Estimation

Introduction

Bin Huang is an inventor associated with Shantou, China, and Shantou Institute of Ultrasonic Instruments Co., Ltd. His patent work concerns ultrasound imaging and methods for estimating tissue attenuation.

Latest Patents

Huang is credited with 1 patent: “Ultrasound Attenuation Coefficient Estimation Using Aberration Compensation and Reference Phantoms.” The invention estimates a human sample’s ultrasound attenuation coefficient by comparing its echo signals with signals from reference phantoms. It selects a phantom and transmit frequency based on the similarity of echo-signal center frequencies at the region of interest, helping compensate for aberration before applying the reference phantom method.

Career Highlights

Huang’s listed invention addresses a technical challenge in quantitative ultrasound: accounting for aberration when estimating attenuation. The method uses measurements from a human sample and multiple reference phantoms to support the estimate.

Collaborations

Huang’s listed coworkers include Liexiang Fan and Bin Li. His company affiliation is Shantou Institute of Ultrasonic Instruments Co., Ltd.

Conclusion

Bin Huang’s patent describes an approach to ultrasound attenuation estimation that combines aberration compensation with reference phantom measurements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…