Harbin, China

Bin Hong

This inventor holds 1 USPTO granted patent. Top assignee: Institute of Food Processing, Haas. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bin Hong. Retrieved from https://idiyas.com/inventor/bin-hong-swj467d1

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Bin Hong and Microwave-Induced Cracking for Easy-to-Cook Whole Grains.

Introduction

Bin Hong is an inventor associated with Harbin, China, and the Institute of Food Processing, Haas. His work includes a food-processing invention designed to make whole grains easier to cook while retaining their complete-grain form.

Latest Patents

Hong is associated with 1 patent, titled “Preparation Method of Easy-to-Cook Whole Grain Based on Microwave-Induced Cracking.” The method applies heat-moisture treatment, followed by short-time microwave-induced cracking, tempering, and cooling. The resulting grains remain intact, expand slightly, and develop fine surface cracks. During rice steaming, their water absorption increases from 1.35 times to 1.9 times the original weight of unprocessed whole grains.

Career Highlights

This invention addresses a practical challenge in whole-grain preparation: improving water absorption and cooking readiness without breaking apart the grain. The disclosed process combines moisture and heat treatment with controlled microwave processing.

Collaborations

Hong’s listed coworkers include Shuwen Lu and Chuanying Ren. The patent is associated with the Institute of Food Processing, Haas.

Conclusion

Bin Hong’s patent presents a processing approach that uses microwave-induced cracking to improve whole-grain water absorption while preserving the grain’s overall structure.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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