Hsinchu, Taiwan

Biing Lu Perng

This inventor holds 1 USPTO granted patent. Top assignee: Chang Chun Plastics Co., Ltd.. Active years: 2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Biing Lu Perng. Retrieved from https://idiyas.com/inventor/biing-lu-perng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: Biing Lu Perng: Innovator in Epoxy Resin Technology

Introduction

Biing Lu Perng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of epoxy resin technology. His innovative work has led to the development of a unique epoxy resin composition that incorporates polyalkyl phenol resins.

Latest Patents

Perng holds a patent for an "Epoxy resin composition containing polyalkyl phenol resins." This invention relates to an epoxy resin composition that comprises polyalkyl phenol resins or polyalkyl phenol epoxy resins or both. The polyalkyl phenol resins are represented by a specific formula, wherein Ra, Rb, and Rc may be the same or different from each other and stand for C1-5 alkyl styryl or halogen respectively. He has 1 patent to his name.

Career Highlights

Biing Lu Perng is associated with Chang Chun Plastics Co., Ltd., where he continues to advance his research and development efforts in epoxy resin technology. His work has been instrumental in enhancing the properties and applications of epoxy resins in various industries.

Collaborations

Perng has collaborated with notable colleagues, including Shang Wen Chen and Hong-Hsing Chen, who have contributed to his research endeavors.

Conclusion

Biing Lu Perng's innovative contributions to epoxy resin technology highlight his role as a significant inventor in the field. His patent reflects a commitment to advancing material science and its applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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