This inventor holds 1 USPTO granted patent. Top assignee: Motorola Corporation. Active years: 1991.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1991
Title: Innovations by Bhagubhai D Patel
Introduction
Bhagubhai D Patel is an accomplished inventor based in Tempe, AZ (US). He holds a patent that showcases his expertise in the field of electroplating. His innovative approach has contributed significantly to the technology surrounding plating solutions.
Latest Patents
Bhagubhai D Patel is credited with a patent titled "Method and apparatus for adjusting plating solution flow characteristics." This invention presents a method and apparatus for electroplating metallized bumps of substantially uniform height on predetermined terminal areas of a substrate. The cup plating apparatus includes elements for adjusting parameters that affect the geometry of the substrate relative to the plating cup, as well as the flow rate of the electroplating solution against the substrate surface. By achieving non-laminar flow of the electroplating solution near the substrate edges, the plating characteristics of the electroplating solution are altered in this region. This innovation substantially offsets the 'edge effect,' ensuring that the resulting plated bump height is uniform across the substrate.
Career Highlights
Bhagubhai D Patel has made significant contributions to the field of electroplating during his career at Motorola Corporation. His work has been instrumental in advancing the technology used in various applications.
Collaborations
Throughout his career, Bhagubhai has collaborated with notable colleagues, including Virgil E Schuster and Reginald K Asher. These collaborations have further enriched his work and contributed to the success of his inventions.
Conclusion
Bhagubhai D Patel's innovative contributions to electroplating technology demonstrate his expertise and commitment to advancing the field. His patent reflects a significant achievement that enhances the uniformity of plated bumps on substrates.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
