Saint Paul, MN, United States of America

Beth M Eichler

This inventor holds 2 USPTO granted patents. Top assignees: H.b. Fuller Licensing & Financing Inc., The Dow Chemical Company, Other. Active years: 2000-2001.


% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 2

Forward Citations = 137(Granted Patents)


Company Filing History:


Years Active: 2000-2001

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Beth M Eichler

Introduction

Beth M Eichler is a notable inventor based in Saint Paul, MN (US). She has made significant contributions to the field of adhesive technology, holding a total of 2 patents. Her work focuses on developing innovative solutions that enhance the performance and application of adhesives.

Latest Patents

Among her latest patents is a "Package comprising low application temperature hot melt adhesive comprising ethylene & alpha-olefin." This invention addresses the need for adhesives that can be applied at lower temperatures, improving safety and efficiency in various applications. Another notable patent is the "Low application temperature hot melt adhesive comprising ethylene," which further emphasizes her commitment to advancing adhesive technology.

Career Highlights

Beth has had a distinguished career, including her tenure at The Dow Chemical Company. Her experience in this leading chemical company has allowed her to develop and refine her innovative ideas, contributing to the advancement of adhesive products in the market.

Collaborations

Throughout her career, Beth has collaborated with esteemed colleagues such as Robert A Dubois and Cynthia L Rickey. These partnerships have fostered a creative environment that has led to the successful development of her patented technologies.

Conclusion

Beth M Eichler's contributions to adhesive technology through her patents and collaborations highlight her role as an influential inventor. Her work continues to impact the industry positively, showcasing the importance of innovation in developing effective adhesive solutions.

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