Dietmannsried, Germany

Bernhard Klaus

This inventor holds 1 USPTO granted patent. Top assignee: Multivac Sepp Haggenmüller Se & Co. Kg. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bernhard Klaus. Retrieved from https://idiyas.com/inventor/bernhard-klaus

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Bernhard Klaus - Innovator in Packaging Technology

Introduction

Bernhard Klaus is a notable inventor based in Dietmannsried, Germany. He has made significant contributions to the field of packaging technology, particularly through his innovative methods that enhance the visual appeal of packaged products.

Latest Patents

Klaus holds a patent for a "Method for automatically maintaining a predetermined portion arrangement in a tray trough and packaging apparatus suitable therefor." This invention aims to ensure that portions are visually appealing, which is crucial in the packaging industry.

Career Highlights

Bernhard Klaus is associated with Multivac Sepp Haggenmüller Se & Co. Kg, a leading company in the packaging sector. His work focuses on developing solutions that improve the efficiency and aesthetics of packaging processes.

Collaborations

Klaus collaborates with his coworker, Albert Hartmann, to further advance their projects and innovations in packaging technology.

Conclusion

Bernhard Klaus is a dedicated inventor whose work in packaging technology has made a significant impact on the industry. His innovative methods continue to enhance the visual appeal of products, showcasing the importance of aesthetics in packaging.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…