Burglengenfeld, Germany

Bernhard Auburger

This inventor holds 1 USPTO granted patent. Top assignee: Siemens Aktiengesellschaft. Active years: 2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bernhard Auburger. Retrieved from https://idiyas.com/inventor/bernhard-auburger

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: Bernhard Auburger: Innovator in Electronic Component Encapsulation

Introduction

Bernhard Auburger is a notable inventor based in Burglengenfeld, Germany. He has made significant contributions to the field of electronic components, particularly through his innovative methods for encapsulation. His work is recognized for enhancing the durability and functionality of electronic devices.

Latest Patents

Auburger holds a patent for a "Method for encapsulating a plurality of electronic components." This method involves coating electronic components with a specialized coating material, which is then hardened. The assembly, including the component and the coating, is encapsulated in plastic. Notably, the coating can be applied through immersion, ensuring a thorough and effective encapsulation process.

Career Highlights

Bernhard Auburger is associated with Siemens Aktiengesellschaft, a leading global technology company. His role at Siemens has allowed him to work on cutting-edge technologies and contribute to advancements in electronic component manufacturing. His patent reflects his commitment to innovation and improving product reliability.

Collaborations

Auburger has collaborated with esteemed colleagues such as Klaus Bauer and Wighard Jäger. These partnerships have fostered a creative environment that encourages the development of new ideas and solutions in the field of electronics.

Conclusion

Bernhard Auburger's contributions to the encapsulation of electronic components demonstrate his innovative spirit and dedication to advancing technology. His work continues to influence the industry and improve the performance of electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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