Munich, Germany

Bernd Winkens

This inventor holds 1 USPTO granted patent. Top assignee: Tyco Electronics Logistics Ag. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bernd Winkens. Retrieved from https://idiyas.com/inventor/bernd-winkens

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Bernd Winkens: Innovator in Power Module Technology

Introduction

Bernd Winkens is a notable inventor based in Munich, Germany. He has made significant contributions to the field of power module technology, particularly with his innovative designs that enhance efficiency and functionality.

Latest Patents

Winkens holds a patent for a "Sandwich-structured intelligent power module." This invention features a power substrate that is inserted into a housing as a base plate. Together, they form a standardized power part, with terminal pins projecting from the top side. These pins are soldered by through-soldering to via holes of the circuit board. The circuit board has contact pads as control and power terminals, allowing the module to be soldered directly into the slot-like opening of a system circuit board. This design improves the integration and performance of power modules in various applications.

Career Highlights

Bernd Winkens is currently employed at Tyco Electronics Logistics AG, where he continues to develop innovative solutions in the electronics sector. His work focuses on creating advanced power modules that meet the growing demands of modern technology.

Collaborations

Winkens collaborates with his coworker, Michael Frisch, to further enhance their projects and drive innovation within their company.

Conclusion

Bernd Winkens is a prominent figure in the field of power module technology, with a patent that showcases his innovative approach. His contributions continue to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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