Schirnding, Germany

Bernd Riedel

This inventor holds 1 USPTO granted patent. Top assignee: Netzsch-Feinmahltechnik Gmbh. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bernd Riedel. Retrieved from https://idiyas.com/inventor/bernd-riedel-in56ifdz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Bernd Riedel - Innovator in Grinding Technology

Introduction

Bernd Riedel is a notable inventor based in Schirnding, Germany. He has made significant contributions to the field of grinding technology. His innovative work has led to the development of a patented grinding element, showcasing his expertise and dedication to advancing industrial processes.

Latest Patents

Bernd Riedel holds a patent for a grinding element. This invention reflects his commitment to improving efficiency and effectiveness in grinding applications. His patent is a testament to his innovative thinking and technical skills.

Career Highlights

Riedel is currently employed at Netzsch-Feinmahltechnik GmbH, a company renowned for its advanced machinery and technology in the field of grinding and dispersing. His role at the company allows him to apply his inventive ideas and contribute to the development of cutting-edge solutions.

Collaborations

Some of Bernd Riedel's coworkers include Holger Moeschl and Witali Sudermann. Their collaboration fosters a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Bernd Riedel is a distinguished inventor whose work in grinding technology has made a significant impact. His patent and contributions to Netzsch-Feinmahltechnik GmbH highlight his role as a key player in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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