This inventor holds 2 USPTO granted patents. Top assignee: Advanced Micro Devices Corporation. Active years: 1999-2000.
Company Filing History:
Years Active: 1999-2000
Title: Bernd Maile: Innovator in Solder Bump Technology
Introduction
Bernd Maile is a notable inventor based in Stuttgart, Germany. He has made significant contributions to the field of semiconductor technology, particularly in solder bump compositions. With a total of 2 patents, his work focuses on improving the reliability and cost-effectiveness of electronic devices.
Latest Patents
One of Bernd Maile's latest patents is related to Graded PB for C4 bump technology. This innovative solder bump composition employs a thin low-alpha layer of lead (Pb) that is strategically deposited near alpha particle sensitive devices. The method utilizes ordinary, low-cost Pb for the bulk of the solder bump, allowing for reduced overall costs while still providing essential protection against alpha-particle induced soft errors. The low-alpha layer minimizes the flux of alpha particles into devices in two significant ways. Firstly, the low-alpha layer is essentially free of Pb.sup.210, resulting in negligible alpha particle emissions. Secondly, this layer is substantially opaque to alpha particles emitted by the ordinary Pb, which contains Pb.sup.210. Consequently, sensitive circuits on semiconductor chips that utilize this improved solder bump are effectively shielded from harmful alpha particle emissions.
Career Highlights
Bernd Maile is currently employed at Advanced Micro Devices Corporation, a leading company in the semiconductor industry. His work has been instrumental in advancing solder bump technology, which is crucial for the performance and reliability of modern electronic devices.
Collaborations
Throughout his career, Bernd has collaborated with esteemed colleagues such as Don A Tiffin and Tim Z Hossain. These collaborations have further enriched his contributions to the field of semiconductor technology.
Conclusion
In summary, Bernd Maile is a distinguished inventor whose work in solder bump technology has made a significant impact on the semiconductor industry. His innovative approaches continue to enhance the reliability and cost-effectiveness of electronic devices.