This inventor holds 1 USPTO granted patent. Top assignee: Emhart Inc.. Active years: 1991.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1991
Title: Bernd Gobel - Innovator in Wire Bonding Technology
Introduction
Bernd Gobel is a notable inventor based in Inning am Holz, Germany. He has made significant contributions to the field of wire bonding technology, particularly in the automation of the bonding process. His innovative approach has led to advancements that enhance the efficiency and quality of electronic component manufacturing.
Latest Patents
Bernd Gobel holds a patent for an automatic wire bonding apparatus designed for wedge-bonding using aluminum wire. This apparatus features a bonding head equipped with a bonding tool mounted on an ultrasonic transducer. The bonding tip of the tool is designed to press aluminum wire against the contact surface of an electronic or electrical component. The wire is drawn from a suitable supply, and a wire clamp allows for the clamping of the wire during operation. The apparatus includes monitoring means to ensure the quality of the bond formed, identifying bonds that do not meet predetermined deformation values due to ultrasonic excitation. This innovation minimizes the time ultrasonic energy is transmitted to the bond, maximizing machine throughput and reducing wastage from unsatisfactory bond formations. Bernd Gobel's patent is a testament to his commitment to improving manufacturing processes in the electronics industry.
Career Highlights
Bernd Gobel is currently associated with Emhart Inc., where he continues to develop and refine technologies related to wire bonding. His work has been instrumental in advancing the capabilities of automated bonding systems, making them more efficient and reliable.
Collaborations
One of his notable collaborators is Andreas Ziemann, with whom he has worked closely to enhance the development of wire bonding technologies. Their partnership has contributed to the successful implementation of innovative solutions in the industry.
Conclusion
Bernd Gobel's contributions to wire bonding technology exemplify the impact of innovation in manufacturing processes. His patent for an automatic wire bonding apparatus showcases his dedication to improving efficiency and quality in electronic component production. His work continues to influence the field, paving the way for future advancements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile