Bernd Ebersberger

Title: Bernd Ebersberger: Innovator in Wafer-Level Package Sensor Technology

Introduction

Bernd Ebersberger is a notable inventor based in Egmating, Germany. He has made significant contributions to the field of sensor technology, particularly through his innovative designs and patents. His work is characterized by a focus on enhancing the functionality and efficiency of sensor devices.

Latest Patents

Ebersberger holds a patent for a wafer-level package sensor device. This device includes a capacitive sensor and a controller that is electrically connected to the sensor. The capacitive sensor is formed by partially overlapping redistribution layer tracks of the wafer-level package sensor device, which are created in different planes. Additionally, the device features multiple contact surfaces connected to the controller, designed to electrically couple to a chip card module carrier using a flip-chip connection. This invention showcases his expertise in integrating advanced technology into practical applications.

Career Highlights

Bernd Ebersberger is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His role at Infineon has allowed him to work on cutting-edge technologies and contribute to the advancement of sensor devices. His dedication to innovation has positioned him as a key figure in his field.

Collaborations

Ebersberger collaborates with various professionals in the industry, including his coworker Frank Püschner. Their combined expertise fosters an environment of creativity and innovation, leading to the development of advanced technologies.

Conclusion

In summary, Bernd Ebersberger is a distinguished inventor whose work in wafer-level package sensor technology has made a significant impact in the field. His contributions continue to influence the development of innovative sensor solutions.