This inventor holds 1 USPTO granted patent. Top assignee: National Semiconductor Corporation. Active years: 2002.
Company Filing History:
Years Active: 2002
Title: Innovations by Bernard K H Lee in Integrated Circuit Packages
Introduction
Bernard K H Lee is a notable inventor based in Singapore, SG. He has made significant contributions to the field of integrated circuit packaging. His work focuses on enhancing thermal performance and reliability in electronic devices.
Latest Patents
One of his key patents is titled "Method and structure for heatspreader attachment in high thermal performance IC packages." This patent presents improved structures and methods for assembling heatspreader attachments in integrated circuit packages. The innovation allows for the attachment of a cost-effective heatspreader with a high coefficient of thermal expansion directly to the back of a die. This method maximizes thermal performance, mechanical integrity, and reliability of the assembly. The improvements are achieved through the use of specific adhesive materials, heatspreader geometries, adhesive geometries, assembly techniques, and underfill geometries. Bernard holds 1 patent in this area.
Career Highlights
Bernard K H Lee is associated with National Semiconductor Corporation, where he applies his expertise in integrated circuit technology. His work has been instrumental in advancing the efficiency and performance of semiconductor devices.
Collaborations
He has collaborated with notable colleagues such as Ben T C Tan and Emillo F Mallare, Jr. Their combined efforts contribute to the innovative environment at National Semiconductor Corporation.
Conclusion
Bernard K H Lee's contributions to integrated circuit packaging demonstrate his commitment to innovation and excellence in the field. His patent on heatspreader attachment is a testament to his expertise and impact on technology.