Benson Mai

Title: **Inventor Spotlight: Benson Mai**

Introduction

Benson Mai is an innovative inventor based in Alhambra, CA, who has made significant contributions to the field of microelectromechanical systems (MEMS). With two patents to his name, his work has the potential to advance the efficiency and functionality of various MEMS devices. His inventive spirit is exemplified in his latest patents, which focus on enhancing electric connectivity in moving stages.

Latest Patents

Benson’s latest patents include the development of electric connection flexures and a low stiffness flexure. The **Electric Connection Flexures** patent discloses an innovative approach to create an electrical and mechanical connection between a fixed frame and a moving frame. These flexures are designed to be flexible within the plane of motion of the moving frame. This design allows for embedding the ends of each flexure into both the fixed and moving frames, enhancing the overall functionality of MEMS devices.

In his second patent, the **Low Stiffness Flexure**, he introduces a unique flexure structure consisting of a support first end connected to a first frame and a support second end connected to a second frame. The critical feature of this flexure is its buckled section, which significantly reduces stiffness during operation. This innovation allows the flexure to maintain a buckled state, thus providing flexibility and adaptability in its performance.

Career Highlights

Benson Mai is currently employed at Mems Drive, Inc., where he applies his expertise in MEMS technology and fosters innovation. His role at the company allows him to collaborate with peers and contribute to groundbreaking advancements within the industry.

Collaborations

Throughout his career, Benson has worked alongside talented colleagues, including Xiaolei Liu and Guiqin Wang. These collaborations have further enriched his work and enabled the development of impactful inventions in the MEMS realm.

Conclusion

Benson Mai's contributions to the field of microelectromechanical systems are poised to make significant waves in technological advancements. With two patents that highlight his expertise in electric connection flexures and low stiffness structures, he stands as a testament to the innovative spirit that drives progress in engineering and technology. As he continues to collaborate with industry professionals, the future looks promising for both him and the MEMS field.