Benson Lee

Title: The Innovative Contributions of Benson Lee

Introduction

Benson Lee is a notable inventor based in Miaoli County, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of specialized polishing pads used in various industries.

Latest Patents

Benson Lee holds a patent for a polyurethane polishing pad designed for planarizing semiconductor, optical, and magnetic substrates. This innovative polishing pad is composed of a cast polyurethane polymeric material created from a prepolymer reaction of HMDI/TDI with polytetramethylene ether glycol. The resulting isocyanate-terminated reaction product contains 1 patent and features specific weight percentages of unreacted NCO and a carefully balanced NH to NCO stoichiometric ratio. The pad is cured with a 4,4'-methylenebis(2-chlororaniline) curative agent, ensuring optimal performance. The material exhibits a shear storage modulus of 250 to 350 MPa and a shear loss modulus of 25 to 30 MPa, making it suitable for high-precision applications.

Career Highlights

Throughout his career, Benson Lee has worked with several prominent companies, including Rohm and Haas Electronic Materials, CMP Holdings, Inc., and Dow Global Technologies LLC. His experience in these organizations has allowed him to refine his expertise in materials development and innovation.

Collaborations

Benson has collaborated with notable professionals in his field, including Bainian Qian and Raymond L. Lavoie, Jr. These partnerships have contributed to the advancement of his research and the successful development of his patented technologies.

Conclusion

Benson Lee's contributions to the field of materials science, particularly through his patented polyurethane polishing pad, highlight his innovative spirit and dedication to advancing technology. His work continues to impact various industries, showcasing the importance of innovation in modern applications.