Hong Kong, China

Benson Cheung Chun Kit

This inventor holds 2 USPTO granted patents. Top assignee: Royal Appliance Mfg., Co.. Active years: 2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Benson Cheung Chun Kit. Retrieved from https://idiyas.com/inventor/benson-cheung-chun-kit

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 25(Granted Patents)


Company Filing History:


Years Active: 2009

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2 patents (USPTO):Explore Patents

Title: The Innovations of Benson Cheung Chun Kit

Introduction

Benson Cheung Chun Kit is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of technology, particularly with his innovative designs. With a total of 2 patents to his name, he continues to push the boundaries of invention.

Latest Patents

One of his latest inventions is a paper shredder, which showcases his commitment to enhancing everyday tools for better efficiency and security. This invention reflects his understanding of consumer needs and his ability to create practical solutions.

Career Highlights

Benson works at Royal Appliance Mfg., Co., where he applies his expertise in developing innovative products. His role in the company allows him to collaborate with other talented individuals in the industry, furthering his impact on technology.

Collaborations

Some of his coworkers include Lau Hee Wing and Leon Kuo Liang Yoong. Their teamwork contributes to a dynamic work environment that fosters creativity and innovation.

Conclusion

Benson Cheung Chun Kit is a dedicated inventor whose work in Hong Kong continues to influence the field of technology. His contributions, particularly in the development of practical inventions like the paper shredder, highlight his innovative spirit and commitment to improving everyday life.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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