Aloha, OR, United States of America

Benny H Johnson

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Merix Corporation. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Benny H Johnson. Retrieved from https://idiyas.com/inventor/benny-h-johnson

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank


Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Benny H Johnson: Innovator in Microelectronic Substrates

Introduction

Benny H Johnson is a notable inventor based in Aloha, Oregon. He has made significant contributions to the field of microelectronics, particularly through his innovative patent related to thermally conductive substrates. His work has implications for the efficiency and performance of microelectronic devices.

Latest Patents

Benny H Johnson holds a patent for "Microelectronic substrates with thermally conductive pathways and methods of making same." This patent describes a substrate that includes a body with a microelectronic component mounting site and a thermally conductive member. The design features an opening that extends through the substrate, allowing for enhanced thermal management in microelectronic applications. The thermally conductive member is designed to fit into this opening, ensuring effective heat dissipation.

Career Highlights

Throughout his career, Benny H Johnson has worked with prominent companies in the electronics industry. He has been associated with Merix Corporation and Viasystems, Inc., where he contributed to advancements in microelectronic technologies. His experience in these organizations has helped shape his innovative approach to substrate design.

Collaborations

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Conclusion

Benny H Johnson's contributions to microelectronic substrates highlight his role as an innovator in the field. His patent reflects a commitment to improving thermal management in electronic devices, showcasing the importance of innovation in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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