Dallas, TX, United States of America

Benjamin Meyer

This inventor holds 1 USPTO granted patent. Top assignee: Bmic LLC. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Benjamin Meyer. Retrieved from https://idiyas.com/inventor/benjamin-meyer-x4zn4jrs

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Benjamin Meyer and Building Envelope Innovation

Introduction

Benjamin Meyer is an inventor based in Dallas, Texas. His patent work concerns building-envelope materials and systems designed for building applications.

Latest Patents

The provided information identifies one patent associated with Meyer: “Building Envelope Membrane for Building Applications and Related Systems and Related Method.” The invention describes a building system with a membrane installed on a building structure. Its layered design includes a removable outer release liner containing a polymer and a UV stabilizer, an adhesive layer, a membrane layer, and a second adhesive layer that contacts the building structure. The release liner is specified to contain 1% to 90% UV stabilizer by weight.

Career Highlights

Meyer is associated with Bmic LLC. His identified patent focuses on a building-envelope membrane and its installation, including features intended to protect the release liner from ultraviolet exposure.

Collaborations

The provided information names James Willits and Steven J. Warakomski as Meyer’s coworkers. No further details about their roles in the patent or related work were provided.

Conclusion

Benjamin Meyer’s identified invention addresses building-envelope membrane construction through a layered system that combines adhesive materials, a membrane, and a UV-stabilized removable release liner.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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