This inventor holds 2 USPTO granted patents. Top assignees: Kollmorgen Corporation, Kollmorgen Technologies Corporation. Active years: 1988-1990.
Company Filing History:
Years Active: 1988-1990
Title: The Innovations of Benjamin G Chin
Introduction
Benjamin G Chin is an accomplished inventor based in Westbury, NY (US). He holds 2 patents that showcase his expertise in the field of coaxial interconnection boards. His innovative methods have contributed significantly to advancements in circuit board technology.
Latest Patents
Chin's latest patents include a method of making coaxial interconnection boards. This invention involves scribing coaxial conductors onto a circuit board substrate. The coaxial conductors are preformed and affixed in a predetermined pattern on the substrate using an adhesive. A conductive layer forming a ground plane covers the surface of the substrate, interconnecting the shields of the coaxial conductors. The conductive material, other than the coaxial signal conductors, is eliminated around the termination points of the coaxial conductors, thereby creating clearance areas. These clearance areas permit connection of the signal conductors to surface terminal pads without shorting to the shield conductors or ground planes.
Career Highlights
Chin has worked with notable companies such as Kollmorgen Technologies Corporation and Kollmorgen Corporation. His experience in these organizations has allowed him to refine his skills and contribute to various projects in the field of electrical engineering.
Collaborations
Some of his coworkers include Michael Vignola and Leonard Shieber. Their collaboration has likely fostered an environment of innovation and creativity in their respective projects.
Conclusion
Benjamin G Chin's contributions to the field of coaxial interconnection boards demonstrate his innovative spirit and technical expertise. His patents reflect a commitment to advancing technology in circuit board design.