Company Filing History:
Years Active: 2019-2022
Title: Innovations of Benjamin C. Backes
Introduction
Benjamin C. Backes is an accomplished inventor based in Poughkeepsie, NY. He has made significant contributions to the field of technology, particularly in the area of interconnect structures. With a total of three patents to his name, Backes has demonstrated his expertise and innovative spirit.
Latest Patents
One of his latest patents is focused on self-aligned via interconnect structures. This patent discloses methods of manufacturing these structures, which include forming a wiring structure in a dielectric material. The process involves creating a cap layer over the surface of the wiring structure and the dielectric material. An opening is then formed in the cap layer to expose a portion of the wiring structure. The method further includes selectively growing a metal or metal-alloy via interconnect structure material on the exposed portion of the wiring structure through the opening in the cap layer. Finally, an upper wiring structure is formed in electrical contact with the metal or metal-alloy via interconnect structure.
Career Highlights
Benjamin C. Backes is currently employed at the International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to explore and develop innovative technologies that have a significant impact on the industry.
Collaborations
Throughout his career, Backes has collaborated with notable coworkers such as Brian A. Cohen and Joyeeta Nag. These collaborations have contributed to the advancement of technology and the successful development of various projects.
Conclusion
Benjamin C. Backes is a prominent inventor whose work in self-aligned via interconnect structures has paved the way for advancements in technology. His contributions at IBM and collaborations with other professionals highlight his commitment to innovation.
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