Benjamin Alexander Haag

Title: Benjamin Alexander Haag: Innovator in High Temperature Adhesives

Introduction

Benjamin Alexander Haag is a notable inventor based in Horgen, Switzerland. He has made significant contributions to the field of adhesive technology, particularly with his innovative epoxy resin systems. His work focuses on creating solutions that withstand high temperature applications, which are crucial in various industrial sectors.

Latest Patents

Haag holds a patent for "High temperature epoxy adhesive formulations." This invention presents an epoxy resin system that serves as an adhesive for high temperature applications. The formulation consists of a combination of diglycidyl ether bisphenol epoxy resin(s) in amounts of 30-70% by weight, along with 1-10% by weight of an epoxy novolac resin, and 10-30% by weight of a polyurethane toughener. The system also includes 1-8% by weight of a hardener and 0.1% by weight of a cure accelerator, preferably a latent urea cure accelerator. This unique combination provides an optimal balance of mechanical strength and elastic modulus, making it suitable for demanding applications.

Career Highlights

Throughout his career, Haag has worked with prominent companies in the electronic materials sector. He has been associated with DDP Specialty Electronic Materials US, LLC, where he contributed to the development of advanced adhesive technologies. His expertise in epoxy formulations has positioned him as a valuable asset in the industry.

Collaborations

Haag has collaborated with notable professionals in his field, including Andreas Lutz and Daniel Schneider. These partnerships have further enhanced his innovative capabilities and contributed to the success of his projects.

Conclusion

Benjamin Alexander Haag is a distinguished inventor whose work in high temperature adhesive formulations has made a significant impact in the industry. His innovative approach and collaboration with industry professionals continue to drive advancements in adhesive technology.