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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11739241 B1

PDFFull Text
Date of Patent:
Aug. 29, 2023

Filed:

Apr. 10, 2018

High temperature epoxy adhesive formulations

Applicant:

Ddp Specialty Electronic Materials Us, Llc, Wilmington, DE (US);

Inventors:

Andreas Lutz, Freienbach, CH;

Daniel Schneider, Freienbach, CH;

Benjamin Alexander Haag, Horgen, CH;

Irene Maeder, Freienbach, CH;

Marcel Aschwanden, Freienbach, CH;

Assignee:

DDP SPECIALTY ELECTRONIC MATERIAL US, LLC, Wilmington, DE (US);

Attorney:
Primary Examiner:

Randy P Gulakowski

Assistant Examiner:

Ha S Nguyen

Int. Cl.
CPC ...
C08G 18/12 (2006.01); C08G 18/32 (2006.01); C08G 18/48 (2006.01); C08G 18/69 (2006.01); C08G 18/73 (2006.01); C08G 59/24 (2006.01); C08G 59/40 (2006.01); C08L 9/02 (2006.01); C08L 63/00 (2006.01); C08L 75/08 (2006.01); C08L 79/02 (2006.01); C08G 59/68 (2006.01); C09J 163/00 (2006.01); C08L 75/04 (2006.01); C09J 11/00 (2006.01); C09J 163/04 (2006.01); C08L 63/04 (2006.01);
U.S. Cl.
CPC ...
C09J 163/04 (2013.01); C08G 18/12 (2013.01); C08G 18/3215 (2013.01); C08G 18/4854 (2013.01); C08G 18/69 (2013.01); C08G 18/73 (2013.01); C08G 59/245 (2013.01); C08G 59/4021 (2013.01); C08L 9/02 (2013.01); C08L 63/04 (2013.01); C08L 75/08 (2013.01); C08L 79/02 (2013.01); C08G 2170/00 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01); C09J 2203/354 (2020.08); C09J 2301/30 (2020.08);
Abstract

The invention is an epoxy resin system useful as an adhesive for high temperature applications. The system is a combination of a diglycidyl ether a bisphenol epoxy resin(s), at amounts of 30-70% by weight, with 1-10% by weight of an epoxy novolac resin 10-30% by weight of a polyurethane toughener which preferably has the terminal isocyanate functional group blocked, 1-8% by weight of a hardener, 0.1-% by weight of a cure accelerator, preferably a latent urea cure accelerator, provides the desired balance of mechanical strength and elastic modulus. The epoxy novolac resin is characterized by at least one of the following features: (i) having a viscosity at 25 degrees C. of less than 3000 mPa-s according to ASTM D-445, (ii) an average number of epoxide groups per molecule of more than 2 but less than 3.7, and (iii) a molecular weight of less than 750 g/mol.

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