Benedict W Pang

Title: **Benedict W. Pang: Innovator in Chemical Mechanical Polishing Technologies**

Introduction

Benedict W. Pang is a distinguished inventor based in Burlingame, California, known for his contributions to the field of chemical mechanical polishing technologies. With a total of two patents to his name, Pang has demonstrated a keen ability to innovate and improve polishing processes used in various industries.

Latest Patents

Benedict W. Pang holds two patents, showcasing his ingenuity in the mechanics behind polishing pads and electrochemical planarization. His latest inventions include:

1. **Controlling Chemical Mechanical Polishing Pad Stiffness by Adjusting Wetting in the Backing Layer**: This invention revolves around a polishing pad designed for chemical mechanical polishing apparatuses. It features a polishing layer with a specialized backing layer made of fluid-permeable material. The unique construction includes seals that segregate the backing layer into distinct regions, enabling optimized performance during the polishing process.

2. **Face-Up Wafer Electrochemical Planarization Apparatus**: This patent describes an advanced electrochemical planarization apparatus that incorporates a chuck body with a substrate support surface. The design features a retaining wall, an electrolyte delivery port, and a spindle configurability. By integrating a conductive end effector and an electric contact linked to a current source, this apparatus enhances the efficiency of planarization processes for substrates.

Career Highlights

Currently, Benedict W. Pang is employed by Applied Materials, Inc., where he applies his expertise in developing innovative solutions in chemical mechanical polishing. His work in this prominent company showcases his commitment to advancing technology in the field.

Collaborations

Throughout his career, Pang has had the pleasure of collaborating with talented individuals, including his coworker Kevin H. Song. Together, they have contributed to the improvement of technologies that are essential for various manufacturing processes.

Conclusion

Benedict W. Pang continues to be a significant figure in the field of chemical mechanical polishing, with his innovative patents paving the way for advancements in this specialized area. His work at Applied Materials, Inc. and collaborations with peers highlight the importance of teamwork and creativity in driving technological progress.