The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2025
Filed:
Feb. 25, 2020
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Kevin H. Song, San Jose, CA (US);
Benedict W. Pang, Burlingame, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/00 (2012.01); B24B 37/005 (2012.01); B24B 37/22 (2012.01); B24B 37/26 (2012.01); B24B 37/32 (2012.01); B24B 53/00 (2006.01);
U.S. Cl.
CPC ...
B24B 37/005 (2013.01); B24B 37/22 (2013.01); B24B 37/26 (2013.01); B24B 53/00 (2013.01);
Abstract
A polishing pad for a chemical mechanical polishing apparatus includes a polishing layer having a polishing surface and a backing layer formed of a fluid-permeable material. The backing layer includes a lower surface configured to be secured to a platen and an upper surface secured to the polishing layer, wherein the lower surface and upper surface are sealed. A first seal circumferentially seals an edge of the backing layer, and a second seal seals and separates the backing layer into a first region and a second region surrounded by the first region.