Springboro, OH, United States of America

Ben J Skaggs

This inventor holds 1 USPTO granted patent. Top assignee: International Paper Company. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ben J Skaggs. Retrieved from https://idiyas.com/inventor/ben-j-skaggs

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 27(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: The Innovations of Ben J Skaggs

Introduction

Ben J Skaggs is an accomplished inventor based in Springboro, Ohio. He has made significant contributions to the field of durable paper technology. His innovative approach has led to the development of a unique paper substrate that enhances strength and durability.

Latest Patents

Ben J Skaggs holds a patent for a durable paper that incorporates synthetic fibers. This invention provides enhanced strength in both the machine direction and the cross direction. Additionally, it improves strength through the cross-section of the sheet. The methods of making and using this substrate further demonstrate his inventive capabilities.

Career Highlights

Skaggs is associated with International Paper Company, where he applies his expertise in paper technology. His work has contributed to advancements in the industry, showcasing his commitment to innovation and quality.

Collaborations

Some of his notable coworkers include Rick C Williams and Graciela Jimenez. Their collaboration has likely fostered a creative environment that encourages the development of new ideas and technologies.

Conclusion

Ben J Skaggs exemplifies the spirit of innovation in the paper industry. His contributions through his patent and work at International Paper Company highlight the importance of durable materials in modern applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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