Been Yu Liaw

Title: Innovations by Been Yu Liaw in Semiconductor Packaging

Introduction

Been Yu Liaw is a notable inventor based in Tai-Chung, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and methods. His work is particularly relevant in today's technology-driven world, where efficient packaging solutions are essential for the performance of electronic devices.

Latest Patents

One of Been Yu Liaw's key patents is titled "Apparatus for packaging semiconductor device and method for packaging the same." This invention presents an apparatus that includes a closed printing chamber with a baseplate at the bottom. The design features a pressure controlling system connected to the closed printing chamber, which enhances the packaging process. Additionally, the baseplate is equipped with a heating unit, and a paste source tank is located within the closed printing chamber. This innovative approach aims to improve the efficiency and effectiveness of semiconductor device packaging.

Career Highlights

Been Yu Liaw is currently associated with World Wiser Electronics Inc., where he applies his knowledge and skills to advance semiconductor packaging technologies. His work at the company reflects his commitment to innovation and excellence in the electronics industry.

Conclusion

Been Yu Liaw's contributions to semiconductor packaging demonstrate his inventive spirit and dedication to improving technology. His patent highlights the importance of innovative solutions in the electronics sector, paving the way for future advancements.