Ostermundigen, Switzerland

Beat Kipfer

This inventor holds 1 USPTO granted patent and 1 published patent application and 2 EPO patents. Top assignee: Kern Ag. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Beat Kipfer. Retrieved from https://idiyas.com/inventor/beat-kipfer

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Beat Kipfer: Innovator in Paper Cutting Technology

Introduction

Beat Kipfer is a notable inventor based in Ostermundigen, Switzerland. He has made significant contributions to the field of paper processing technology. His innovative approach has led to the development of a unique device for cutting paper webs.

Latest Patents

Kipfer holds a patent for a "Device for cutting paper webs." This device features a continuously operated region for paper supply and a discontinuously operated region for transverse severing. It includes a buffer region that connects these two operational areas. The design allows for the paper webs to be looped in a freely suspended manner, enhancing the efficiency of the cutting process.

Career Highlights

Throughout his career, Beat Kipfer has worked with several companies, including Kern AG and his own venture, Kipfer, Beat. His experience in these organizations has contributed to his expertise in paper processing technologies.

Collaborations

Kipfer has collaborated with notable professionals in his field, including René Kröhnert and Wolfgang Freyer. These partnerships have fostered innovation and development in his projects.

Conclusion

Beat Kipfer's contributions to paper cutting technology exemplify his innovative spirit and dedication to improving industrial processes. His patent and career achievements reflect his significant impact on the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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