Kentwood, MI, United States of America

Barry W Weddle, Jr

This inventor holds 1 USPTO granted patent. Top assignee: Dematic Gmbh. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Barry W Weddle, Jr. Retrieved from https://idiyas.com/inventor/barry-w-weddle-jr

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Barry W. Weddle, Jr.: Inventor of a Real-Time Belt Tension Sensing System

Introduction

Barry W. Weddle, Jr. is an inventor based in Kentwood, Michigan, whose patent work addresses real-time monitoring of belt tension in conveyance and drive systems. His invention is designed to help measure belt tension while the belt is operating.

Latest Patents

Weddle is associated with 1 patent, titled “Real-Time Belt Tension Sensing System.” The system uses an engagement assembly that remains in substantially continuous contact with a moving belt. As the belt travels in its drive direction, it moves the assembly in a perpendicular slack direction. A sensor detects the assembly’s position and sends a signal to an electronically connected controller, which interprets that signal to produce a tension measurement.

Career Highlights

Weddle is associated with Dematic GmbH, a company focused on material handling and automation. His patented system reflects an engineering approach to monitoring belt tension during operation.

Collaborations

Michael Reed and Paul E. Berna are identified as Weddle’s coworkers. The available information does not specify their roles in the patent or the development of the sensing system.

Conclusion

Barry W. Weddle, Jr.’s patent describes a practical method for measuring belt tension in real time, connecting mechanical movement with sensor feedback and electronic control.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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