Barry C Johnson

Title: Barry C Johnson - Innovator in Semiconductor Packaging

Introduction

Barry C Johnson is a notable inventor based in Tucson, AZ, who has made significant contributions to the field of semiconductor packaging. With a focus on improving the efficiency and reliability of electrical components, Johnson's work has garnered attention in the industry.

Latest Patents

Johnson holds a patent for a semiconductor package that features a metal or metal alloy leadframe. This leadframe is designed with both first and second surfaces, allowing for an electrical component to be effectively connected. The innovative design includes a polymer bond to a copper or copper alloy base member, as well as a cap member. The inside surfaces of the cap and base members are coated with a metal or metal alloy, enhancing the polymer bond. This design increases the surface area of the base member, facilitating better heat transfer from the silicon chip and reducing thermal stresses.

Career Highlights

Barry C Johnson is currently employed at Olin Corporation, where he continues to develop and refine technologies related to semiconductor packaging. His expertise in this area has positioned him as a valuable asset to his team and the company.

Collaborations

Throughout his career, Johnson has collaborated with talented individuals such as Jacob Crane and Deepak Mahulikar. These partnerships have contributed to the advancement of innovative solutions in the semiconductor industry.

Conclusion

Barry C Johnson's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in engineering. His patent and work at Olin Corporation reflect his significant impact on the field.