Company Filing History:
Years Active: 1990
Title: Barbara J McNelis: Innovator in Thermal Enhancement Technology
Introduction
Barbara J McNelis is a prominent inventor based in Austin, TX (US). She has made significant contributions to the field of electronic component packaging, particularly in thermal enhancement technology. With a total of 2 patents, her work has had a notable impact on the efficiency and reliability of electronic devices.
Latest Patents
Barbara's latest patents include a "Method for attaching heat sink to plastic packaged electronic component." This patent describes an improvement for thermal enhancement technology for high power dissipating plastic packaged electronic circuit chips. It focuses on providing structural features in the plastic package that are adapted to snap fit with complementarily formed edges of heat sink members. Another significant patent is for an "Integrated circuit package with improved cooling means." This invention details an integrated circuit chip package where the chip is mounted face down on a plurality of flexible inner beam leads. The package's outer beam leads are bonded to pads on an underlying circuit board, and a convective heat sink is thermally mounted to the reverse face of the chip. This heat sink, formed from folded thin metal sheet, exhibits both minimum mass and optimum cooling efficiency.
Career Highlights
Barbara J McNelis is associated with International Business Machines Corporation (IBM), where she has contributed her expertise in electronic packaging and thermal management. Her innovative approaches have led to advancements in the design and functionality of electronic components.
Collaborations
Throughout her career, Barbara has collaborated with notable colleagues, including Marvin L Buller and Campbell H Snyder. These collaborations have further enriched her work and contributed to the development of cutting-edge technologies in her field.
Conclusion
Barbara J McNelis stands out as a key figure in the realm of thermal enhancement technology for electronic components. Her patents reflect her commitment to innovation and her ability to address complex challenges in electronic packaging.