The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 1990
Filed:
Sep. 21, 1988
Brian D Arldt, Austin, TX (US);
Peter H Bruhn, Georgetown, TX (US);
M Lawrence Buller, Austin, TX (US);
Peter G Ledermann, Pleasantville, NY (US);
Stephen D Linam, Round Rock, TX (US);
Barbara J McNelis, Austin, TX (US);
Lawrence S Mok, Yorktown Heights, NY (US);
Paul A Moskowitz, Yorktown Heights, NY (US);
International Business Machines Corp., Armonk, NY (US);
Abstract
An integrated circuit chip package is described wherein the chip has an active face including a plurality of input and output pads. The chip is mounted face down on a pluralilty of flexible inner beam leads. The package's outer beam leads are bonded to pads residing on an underlying circuit board. A convective heat sink is thermally mounted to the reverse face of the chip, which heat sink is formed from folded thin metal sheet. The heat sink exhibits both minimum mass, and optimum cooling efficiency. The minimum mass reduces the cost of the heat sink through material savings and minimizes the possibility of damage to the package caused by sudden acceleration. The heat sink, in addition to itself being somewhat flexible, is provided with mounting points which are physically connected to the underlying circuit board via resilient connecting means.