Beijing, China

Baosheng Wang

USPTO Granted Patents = 2 

Average Co-Inventor Count = 17.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2014-2015

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2 patents (USPTO):Explore Patents

Title: Baosheng Wang: Innovator in Copper Plate Technology

Introduction

Baosheng Wang is a notable inventor based in Beijing, China. He has made significant contributions to the field of mold technology, particularly through his innovative designs for copper plates used in industrial applications. With a total of two patents to his name, Wang's work focuses on enhancing the efficiency and durability of these components.

Latest Patents

Wang's latest patents include a chamfered narrow side copper plate for molds with a funnel-shaped curved surface. This design features a working face that contacts molten steel, consisting of a middle area and two chamfered areas on either side. The unique funnel-shaped curved surface is larger at the top and smaller at the bottom. This innovation ensures uniform cooling of the chamfered surface, thereby enhancing the service life of the narrow side copper plate.

Career Highlights

Throughout his career, Baosheng Wang has worked with prominent organizations such as the Central Iron and Steel Research Institute and the Zhong Da National Engineering and Research Center of Continuous Casting Technology. His experience in these institutions has allowed him to refine his expertise in mold technology and contribute to advancements in the field.

Collaborations

Wang has collaborated with notable colleagues, including Yong Gan and Chunzheng Yang. Their combined efforts have fostered innovation and development in the technologies they work on.

Conclusion

Baosheng Wang's contributions to the field of mold technology through his innovative designs for copper plates demonstrate his commitment to enhancing industrial processes. His patents reflect a deep understanding of material science and engineering principles, making him a valuable figure in the industry.

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