Shanghai, China

Baojun Wang

This inventor holds 1 USPTO granted patent. Top assignee: Shanghai University. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Baojun Wang. Retrieved from https://idiyas.com/inventor/baojun-wang-l4wg4qrx

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 8.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Innovations of Baojun Wang in Directional Solidification

Introduction

Baojun Wang is a notable inventor based in Shanghai, China. He has made significant contributions to the field of directional solidification, particularly through his innovative patent related to liquid metal spraying enhanced cooling.

Latest Patents

Wang holds a patent for an "Apparatus, method, and process for directional solidification by liquid metal spraying enhanced cooling (LMSC)." This invention focuses on improving the solidification structure of castings. The process allows for the regulation of dendrite spacing, which helps in reducing or avoiding metallurgical defects. It is particularly useful for preparing high-quality large-sized columnar or single crystal blades and other castings.

Career Highlights

Baojun Wang is affiliated with Shanghai University, where he continues to advance research in materials science and engineering. His work has garnered attention for its practical applications in manufacturing and materials development.

Collaborations

Wang collaborates with esteemed colleagues, including Zhongming Ren and Jiang Wang, who contribute to his research endeavors.

Conclusion

Baojun Wang's innovative work in directional solidification showcases the potential for advancements in manufacturing processes. His contributions are paving the way for higher quality materials in various industries.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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