Bao-Jun Li

Title: Innovations of Bao-Jun Li in Flexible Circuit Board Technology

Introduction

Bao-Jun Li is a notable inventor based in Qinhuangdao, China. He has made significant contributions to the field of flexible circuit board technology, holding a total of 2 patents. His work focuses on methods that enhance the performance of flexible circuit boards, particularly in transmitting high-frequency signals with reduced attenuation.

Latest Patents

Bao-Jun Li's latest patents include a method for manufacturing a flexible circuit board and the flexible circuit board itself. The method involves creating an inner wiring board with a conductive wiring layer and substrate layer, which is designed to minimize signal loss. The flexible circuit board features two outer wiring boards that enclose the inner wiring board, allowing for improved signal transmission by partially surrounding the signal line with air of very low dielectric constant. These innovations are crucial for applications requiring high-frequency signal integrity.

Career Highlights

Throughout his career, Bao-Jun Li has worked with prominent companies in the electronics industry. He has been associated with Hongqisheng Precision Electronics Co., Ltd. and Avary Holding (Shenzhen) Co., Limited. His experience in these organizations has contributed to his expertise in developing advanced electronic components.

Collaborations

Bao-Jun Li has collaborated with several professionals in his field, including Yang Li and Yan-Lu Li. These collaborations have likely fostered innovation and the exchange of ideas, further enhancing his contributions to flexible circuit board technology.

Conclusion

Bao-Jun Li's work in flexible circuit board technology exemplifies the importance of innovation in the electronics industry. His patents and career achievements reflect a commitment to advancing technology that meets the demands of modern communication systems.