The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
Jun. 29, 2020
Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd., Qinhuangdao, CN;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
Bao-Jun Li, Qinhuangdao, CN;
Yang Li, Guangdong, CN;
Yan-Lu Li, Shenzhen, CN;
Li-Kun Liu, Shenzhen, CN;
HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Qinhuangdao, CN;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
Abstract
A flexible circuit board capable of transmitting high frequency signals with reduced attenuation includes two outer wiring boards enclosing an inner wiring board. The inner wiring board includes a first conductive wiring layer and a first substrate layer. The first conductive wiring layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductive wiring layer and defines first through holes which expose the signal line. Each of the two outer wiring boards includes a second substrate layer and a second conductive wiring layer. The second substrate layer abuts the inner wiring board and defines second through holes aligning with the first through holes, to partially surround the signal line with air of very low dielectric constant. A method for manufacturing the flexible circuit board is also disclosed.