SuZhou, China

Bao Hua Mao

This inventor holds 1 USPTO granted patent. Top assignee: Black Decker Inc.. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bao Hua Mao. Retrieved from https://idiyas.com/inventor/bao-hua-mao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 31(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: The Innovations of Bao Hua Mao

Introduction

Bao Hua Mao is a notable inventor based in SuZhou, China. He has made significant contributions to the field of engineering, particularly with his innovative designs in tools. His work has garnered attention for its practicality and efficiency.

Latest Patents

Bao Hua Mao holds a patent for a circular saw blade. This invention showcases his ability to enhance existing tools, making them more effective for users. The circular saw blade is designed to improve cutting precision and durability.

Career Highlights

Mao is currently employed at Black & Decker Corporation, a leading company in the manufacturing of power tools and home improvement products. His role at the company allows him to apply his inventive skills in a practical setting, contributing to the development of new products.

Collaborations

Throughout his career, Bao Hua Mao has worked alongside talented individuals such as David Brutscher and John P Wells. These collaborations have fostered an environment of creativity and innovation, leading to the development of advanced tools and technologies.

Conclusion

Bao Hua Mao's contributions to the field of tool innovation are commendable. His patent for the circular saw blade exemplifies his commitment to improving engineering solutions. His work at Black & Decker Corporation and collaborations with other professionals further highlight his impact in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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